Copper Tungsten alloy by the high conductivity

Copper Tungsten alloy by the high conductivity of copper and refractory metal tungsten composition. Metallic tungsten and copper neither dissolve nor form an intermetallic compound, tungsten and copper can only form pseudoalloy. W-Cu alloy presents the advantages of high temperature resistance, high hardness and low expansion coefficient of tungsten, as well as the comprehensive excellent performance of copper such as high thermal conductivity and good ductility. Materials have excellent resistance to arc erosion, anti-welding and good electrical conductivity, thermal conductivity, have been widely used in medium and high voltage electrical, telecommunications, aerospace and defense and other fields.

In general, the tungsten-copper alloy is prepared by a method of mechanically mixing tungsten powder and copper powder, forming and sintering, or by infiltration process. However, due to the very different nature of tungsten and copper, it is difficult to achieve an even distribution of tungsten and copper, resulting in reduced or unstable performance. The use of tungsten-copper composite powder can solve the above problems. At present, the methods of preparing tungsten-copper composite powders at home and abroad mainly include mechanical alloying, sol-gel method and mechanical-thermal chemical synthesis method, but the mechanical alloying method and sol-gel method are difficult to produce tungsten phase and copper Equal distribution of copper and tungsten composite powder.

The mechanical-thermochemical synthesis of copper-tungsten composite powder is not pure. At present, various new possible applications of tungsten-copper composite materials are being continuously developed and studied. Different sizes of tungsten powder have different applications after electroless copper plating. The small-size tungsten powder after electroless plating is widely used Used in the field of microelectronic information technology and aerospace, such as electronic packaging, heat sink material and rocket nozzles, aircraft throat lining; Tungsten coated with large particle size has been widely used in military applications, for example, can be used to prepare the drug cover, because The appropriate particle size of the coarse tungsten powder density, can greatly enhance the armor piercing armor power.

The study of electroless copper plating begins with tungsten powder, but all of them are aimed at the tungsten powder with a small particle size. The effects of complexing agent, formaldehyde and concentration of copper sulfate solution on the performance of electroless copper plating are studied. Due to copper plating on the surface of tungsten powder, the particle Cobalt Plate size has a large influence on the electroless copper plating process.